YCS 138°C Low-Temperature Lead-Free Solder Paste

Product details

YCS 138°C Low-Temperature Lead-Free Solder Paste

The YCS 138°C is a premium-grade low-temperature solder paste specifically formulated for the delicate task of “sandwich” motherboard reballing. With a precise melting point of $138°\text{C}$, it allows technicians to resolder middle layers and sensitive ICs without risking high-heat damage to internal components. Engineered for the iPhone X through iPhone 17 series and high-end Android logic boards, this lead-free paste offers exceptional wetting, high conductivity, and a smooth, uniform finish

In stock

Delivery: 1-3 Days

Description

Precision Thermal Control for Modern Multi-Layer MotherboardsAs smartphone motherboards transition to double-layered “sandwich” designs, thermal management during repair has become critical. The YCS 138°C Solder Paste provides the perfect balance of low-heat melting and high-strength bonding to ensure successful repairs every time.Key Features:Precise $138°\text{C}$ Melting Point: Optimized for low-temperature applications. It melts significantly lower than standard $183°\text{C}$ or $217°\text{C}$ pastes, protecting the CPU and NAND from “heat soak” during the re-layering process.Lead-Free & Environmentally Friendly: Formulated with high-purity Sn-Bi (Tin-Bismuth) alloys to meet modern environmental standards while maintaining excellent electrical performance.Superior Wetting & Adhesion: Features an advanced flux carrier that prevents oxidation and ensures the solder “wets” the copper pads instantly, creating a strong mechanical and electrical bond with zero voids.Syringe Dispenser Design: Provided in a convenient industrial syringe with a precision needle tip, allowing for controlled, mess-free application directly onto BGA stencils or motherboard pads.Stable Micro-Spheres: The paste contains uniform micron-sized solder balls that prevent “solder beading” and bridge formation, which is essential when working on high-density 0.1mm pitch components.No-Clean Low Residue: The specialized flux evaporates cleanly, leaving behind minimal, non-corrosive residue. This maintains the aesthetic and functional integrity of the logic board without intensive ultrasonic cleaning.Extended Shelf Life: Packaged in UV-resistant syringes to maintain the consistency and activity of the flux, ensuring the paste remains “tacky” and ready for use over long periods in a professional GSM shop.Technical Specifications:Brand: YCSModel: 138° Low-Temp SeriesAlloy Composition: Sn42 / Bi58 (Lead-Free)Melting Point: $138°\text{C}$ ($280°\text{F}$)Particle Size: Type 4 / Type 5 (High Precision)Weight: Standard Repair Syringe ($20\text{g} – 42\text{g}$ approx.)Application: Motherboard Middle Layer Soldering, CPU Reballing, Sensitive IC Repair.