
Product details
RF4 RF-FTH Universal Integrated Circuit (IC) Solder Implantation Fixture
The RF4 RF-FTH is a specialized, high-precision chip-level repair fixture designed for seamless solder implantation and IC reballing. Engineered with a multi-functional clamping system, it provides absolute stability for mobile phone motherboards and individual IC chips during delicate soldering procedures. Featuring high-temperature resistance and a non-slip weighted base, the RF-FTH is the essential workstation for technicians performing CPU, NAND, and Power IC restoration on iPhone and Androi
In stock
Delivery: 1-3 Days
Description
Precision Engineering for Micro-Solder ImplantationThe RF4 RF-FTH is built for technicians who demand surgical accuracy during the reballing process. By combining a robust chip-holding mechanism with a heat-stabilized work surface, it eliminates the “chip-drifting” issues common with inferior fixtures.Key Features:Universal IC Compatibility: The adjustable sliding tension arms are designed to securely hold various IC sizes, from small power management chips to large CPU and NAND Flash processors.Specialized Solder Implantation Surface: The fixture features a recessed area optimized for solder paste application and stencil alignment, ensuring perfectly uniform solder balls across the BGA grid.Industrial Heat Resistance: Constructed from high-density synthetic stone and premium alloys, the RF-FTH can withstand direct exposure to hot air stations ($500°\text{C}+$) without warping or transferring excessive heat to your workbench.One-Handed Operation: The ergonomic spring-loaded clamping system allows for rapid chip swaps, increasing efficiency during high-volume motherboard swaps or data recovery tasks.Weighted Anti-Slip Foundation: Its heavy-duty metal base ensures the fixture remains stationary under the microscope, even when you are scraping off tough underfill glue or old solder.Protective Clamping Jaws: The contact points are precision-milled to provide a firm grip without damaging the sensitive edges or corners of delicate silicon wafers.Technical Specifications:Brand: RF4 (Repair Friend)Model: RF-FTHMaterial: Anodized Aluminum + High-Temperature Synthetic StoneFunction: IC Reballing, Solder Implantation, Chip Cleaning, Glue RemovalCompatibility: iPhone, Android, and general SMD/BGA componentsDesign: Low-profile for comfortable microscope usage