RF FT3X Precision Dual-Axis Motherboard Fixture

Description

Ultimate Stability for High-Density Logic Board RepairIn modern smartphone repair, even a millimeter of movement can ruin a delicate trace or misalign a BGA chip. The RF FT3X Fixture is built to eliminate movement entirely, providing a rock-solid foundation for work under the microscope.Key Features:Independent Dual-Axis Clamping: Unlike single-rail holders, the FT3X features two independently adjustable clamping zones. This allows you to secure a motherboard on one side while simultaneously holding a separate IC chip for glue removal on the other. Elite Heat-Resistant Synthetic Stone: The clamping jaws are lined with premium, anti-static synthetic stone that withstands direct heat from hot air guns ($500°\text{C}+$). It provides excellent thermal insulation, protecting your workbench and preventing the fixture from becoming too hot to touch.Universal Multi-Point Grip: The specialized “sawtooth” and “groove” design of the jaws ensures a non-slip grip on oddly shaped PCBs, including the L-shaped motherboards found in modern iPhones and flagship Android devices.Dedicated IC Repair Slots: Integrated precision-milled areas are specifically designed to hold CPUs, Power ICs, and Nand chips securely, making the “cleaning and scraping” of underfill glue safer and faster.Industrial Heavyweight Base: Constructed with a solid stainless steel chassis and high-friction silicone feet. The added weight prevents the fixture from sliding or tipping during high-pressure scraping or desoldering.Precision Spiral Drive: High-quality threaded rods ensure smooth, micro-adjustable tension, giving you total control over the clamping pressure to prevent PCB warping.Technical Specifications:Brand: RF (Repair Friend)Model: FT3XMaterial: Stainless Steel + High-Density Synthetic StoneClamping Type: Dual-Axis Independent Compatibility: Universal (iPhone, Samsung, Huawei, Xiaomi, iPad, etc.) Application: BGA Reballing, Motherboard Soldering, IC Glue Removal, FaceID Repair.