RELIFE RL-406 HIGH TEMPERATURE LEAD FREE TIN PASTE

Description

RELIFE RL-406 227°C High-Temperature Lead-Free Solder Paste – 40gRELIFE RL-406 is a professional high-temperature solder paste designed for advanced mobile-phone motherboard and electronics repair. Its lead-free formulation and 227°C melting point make it suitable for applications requiring strong, stable and heat-resistant solder joints.The high-viscosity paste helps maintain position during heating and provides effective wetting for accurate soldering and rework. It is particularly suitable for middle-layer tin planting, IC work and compatible iPhone 12-series motherboard repair.Key FeaturesHigh-temperature 227°C melting pointLead-free formulationHigh-purity solder pasteHigh viscosity for controlled applicationEffective wetting and solder flowCreates strong and stable solder jointsSuitable for hot-air reworkIdeal for motherboard and IC repairSuitable for middle-layer tin plantingApproximately 40g compact jarProduct SpecificationsBrand: RELIFEModel: RL-406Product Type: High-Temperature Solder PasteMelting Point: 227°CFormulation: Lead-freeNet Content: Approximately 40gPackaging: Compact screw-top jarApplication: Motherboard, IC and precision electronics reworkProfessional-use product. Work in a well-ventilated area and follow the correct temperature profile for the component being repaired.