Martview RB-01 Professional BGA Reballing Stencil Full Set

Product details

Martview RB-01 Professional BGA Reballing Stencil Full Set

The Martview RB-01 is a comprehensive, high-precision BGA reballing stencil set designed for the elite motherboard repair technician. Featuring a unique black magnetic steel construction and a specialized “stepped” hole design, it ensures perfect solder ball formation while preventing stencil warping under heat. This full set covers a vast array of common ICs for iPhone, Android, and universal electronic components, making it the definitive solution for high-success-rate chip-level reballing and

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Delivery: 1-3 Days

Description

Precision Reballing for the Modern GSM LaboratoryEngineered to overcome the common failures of standard silver stencils, the Martview RB-01 Full Set utilizes advanced materials and manufacturing techniques to provide a seamless reballing experience for the most complex BGA chips.Key Features:Premium Black Magnetic Steel: Unlike traditional stencils, the RB-01 is treated with a specialized black finish that absorbs heat more uniformly and resists the magnetic pull of some work platforms, ensuring the stencil remains perfectly flat during the heating process.Exclusive “Stepped” Hole Design: The stencil holes are laser-cut with a micro-stepped geometry. This feature prevents solder paste from sticking to the stencil walls, allowing for a clean release and perfectly uniform solder balls every time.Anti-Warping Thermal Stability: Forged from high-grade alloy steel, these stencils are built to withstand repeated thermal cycles without buckling or deforming, maintaining precision alignment even at high lead-free melting points.Comprehensive Full Set Coverage: The RB-01 kit includes multiple plates covering:iPhone Series: CPU, NAND, Power IC, and Baseband components.Android Flagships: Dedicated layouts for Qualcomm, Exynos, and MTK chipsets.Universal BGA: A wide variety of pitch sizes ($0.3\text{mm} – 1.5\text{mm}$) for generic electronic components.Laser-Precision Alignment: Every hole is CNC-drilled with sub-micron accuracy, ensuring that every solder ball lands exactly on the PCB pad, reducing the risk of bridges or “dry” joints.Chemical & Oxidation Resistance: The black coating provides an additional layer of protection against corrosive fluxes and solder pastes, significantly extending the life of the stencil set.Technical Specifications:Brand: MartviewModel: RB-01 (Black Series)Material: High-Grade Black Magnetic Alloy SteelThickness: $0.12\text{mm}$ (Optimized for Solder Paste Volume)Manufacturing: High-Precision CNC Laser CuttingCompatibility: iPhone, Samsung, Huawei, Xiaomi, and Universal BGA ICs.