MAGMA C115 (K)SOLDERING TIP

Description

The Ultimate Multitasking Tool for Micro-ReworkWhile needle tips handle the fine wires, the MAGMA C115-K handles the heavy lifting of surface preparation. Its unique “K-type” blade design provides a larger surface area for heat transfer while maintaining a sharp edge for precision scraping.Key Features:Micro-Knife Geometry (1.5mm): The small, sharp blade is perfectly sized for mobile phone motherboards. It allows for “drag soldering” (soldering multiple pins in one pass) and effective cleaning of residual solder from BGA pads.Integrated Nano-Heater Technology: Built with an internal heating core and thermal sensor, the tip reaches operating temperature ($350°\text{C}$) in approximately 2 seconds, ensuring no “cold joints” during rapid rework. Multi-Layer Iron Plating: The blade is forged with high-purity copper and protected by heavy-duty iron and chrome plating. This ensures the edge stays sharp and resists the erosive effects of lead-free solder.Underfill & Glue Management: The knife edge is ideal for gently scraping away cured underfill or resin from around CPU and Power IC chips without scratching the PCB mask.Universal C115 Compatibility: Seamlessly fits all professional stations using the C115 / NT115 / T115 handle system, including JBC, Sugon, Aixun, and MAGMA digital stations.Gold-Plated Connector Tail: Ensures maximum electrical conductivity and precise temperature feedback to the station’s CPU.Technical Specifications:Brand: MAGMAModel: C115-K (Knife/Blade)Blade Width: $1.5\text{mm}$Material: Oxygen-Free Copper / Multi-Layer Nano PlatingCompatibility: C115 / NT115 / T115 Series HandlesApplication: BGA Pad Cleaning, Drag Soldering, Underfill Removal, FPC Connector Repair.