Product details
2UUL PB02 PadBall Solder Balls for Android(100000 BALLS)
The 2UUL PB02 PadBall is a high-volume, professional-grade set of 100,000 lead-free BGA solder balls, specifically optimized for Android smartphone IC repair. These precision-engineered spheres offer exceptional sphericity and size uniformity, making them the industry standard for reballing Qualcomm, MediaTek, and Exynos CPUs. With a high-purity composition and excellent thermal conductivity, the PB02 series ensures long-lasting, reliable connections for Android logic boards, from flagship Samsu
In stock
Delivery: 1-3 Days
Description
Engineered for the Android Repair ProfessionalAndroid motherboards often feature larger, high-density chips and varied thermal profiles. The 2UUL PB02 PadBall series is designed to meet these challenges by providing high-purity, lead-free spheres that deliver the mechanical strength and electrical performance required for modern Android hardware.Key Features:100,000 Count Value Pack: A massive supply of precision spheres housed in a high-quality jar, designed for professional high-volume workshops and industrial-level rework.Optimized for Android Architectures: While PB01 is tailored for iPhone, the PB02 series is curated with sizes and alloy properties that cater to the diverse needs of Android CPUs (Snapdragon, Dimensity), EMMC, and UFS memory chips.Lead-Free Environmental Compliance: Manufactured using premium lead-free alloys, ensuring your repairs meet global environmental and safety standards while providing superior joint durability.Precision Size Consistency: Each ball undergoes a strict filtering process to ensure uniform diameter. This prevents “tilt” during the reflow process, ensuring the IC sits perfectly flat on the PCB.Superior Wetting & Anti-Oxidation: The balls are treated with a specialized surface coating that inhibits oxidation, allowing them to fuse instantly with flux and solder pads for a mirror-finish joint.High Thermal Resistance: Specifically formulated to withstand the thermal cycling of high-performance Android processors, preventing joint cracks and “dead-chip” symptoms.Technical Specifications:Brand: 2UULModel: PB02 (PadBall Series – Android Focused)Quantity: $100,000\text{ Pieces}$Alloy Type: Lead-Free (High-Purity Composition)Available Sizes: $0.2\text{mm}, 0.25\text{mm}, 0.3\text{mm}, 0.35\text{mm}, 0.4\text{mm}, 0.45\text{mm}$ (Choose size based on IC model)Application: Android CPU Reballing, EMMC/UFS Memory Repair, PMIC, and Power Management IC Restoration.