Product details
2UUL PB01 PadBall Solder Balls for iPhone (100000 BALLS)
The 2UUL PB01 PadBall series is an elite-grade collection of 100,000 high-purity BGA solder balls, engineered for professional micro-soldering and IC restoration. Designed specifically for the high-density components found in flagship smartphones, these leaded ($63/37$) spheres offer a consistent melting point, perfect sphericity, and superior wetting. Whether you are reballing an iPhone CPU, Nand Flash, or Baseband IC, the PadBall PB01 ensures factory-level precision and long-term joint reliabi
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Description
Precision-Engineered for the Master TechnicianWhen reballing high-pin-count ICs, the uniformity of your solder balls is the difference between a successful boot and a short-circuited board. The 2UUL PB01 PadBall series provides the microscopic accuracy required for modern electronics repair.Key Features:100,000 Sphere Bulk Pack: A high-volume supply designed for professional repair laboratories. The quantity ensures you are always prepared for large-scale IC rework. Perfect Sphericity & Size Consistency: Each ball is manufactured to strict tolerances, ensuring that every pad on your BGA chip receives the exact same volume of solder, preventing bridged pins and “uneven” chips.Premium $63/37$ Leaded Composition: The industry-standard “Eutectic” alloy ($63\%\text{ Tin} / 37\%\text{ Lead}$) provides a sharp melting point at $183°\text{C}$. This ensures a fast reflow with excellent thermal and mechanical fatigue resistance.Enhanced Oxidation Resistance: Treated with a specialized anti-oxidation coating to ensure the spheres remain bright and easy to tin, even after long-term storage in the jar.Optimized for iPhone Logic Boards: Available in multiple microscopic diameters (e.g., $0.2\text{mm}, 0.25\text{mm}, 0.3\text{mm}, 0.35\text{mm}, 0.4\text{mm}, 0.45\text{mm}$) to match the specific pad requirements of various A-Series CPUs and Power ICs.High-Speed Reballing Compatibility: Works perfectly with both direct-heat and station-based reballing stencils, allowing the balls to “seat” quickly and securely into the stencil apertures.Technical Specifications:Brand: 2UULModel: PB01 (PadBall Series)Quantity: $100,000\text{ Pieces}$Alloy Type: Leaded ($Sn63/Pb37$)Melting Point: $183°\text{C}$Available Sizes: $0.2\text{mm}$ to $0.45\text{mm}$ (Choose size based on IC type)Application: CPU Reballing, Nand Flash, Baseband, WiFi IC, and PMIC restoration.