Product details
2UUL FS200 JOINT X Solder Paste for Repair 200℃ 50g
The 2UUL FS200 Joint X is a premium, high-temperature solder paste engineered for extreme durability and high-conductivity repairs. Featuring a precise 200°C melting point, it is specifically designed for high-stress components such as CPUs, Power ICs, and charging ports that demand maximum structural integrity. With its 50g high-capacity jar and specialized alloy composition, the FS200 provides industrial-grade bonding for flagship iPhone and Android motherboards, ensuring your repairs withstan
In stock
Delivery: 1-3 Days
Description
Maximum Strength for Critical Circuit JunctionsWhen structural failure is not an option, the 2UUL FS200 Joint X is the technician’s top choice. In modern smartphones, components like the CPU and charging connectors undergo significant thermal cycling and physical stress. The 200°C threshold ensures a robust, lead-free joint that offers superior mechanical strength compared to standard low-melt pastes. Key Features:High-Temperature 200°C Melting Point: Engineered for reliability. This “Joint X” variant is perfect for components that generate high heat, preventing the solder joints from softening or failing during intensive device use.Lead-Free & Environmentally Safe: Complies with modern manufacturing standards while delivering a high-purity alloy that mimics the reliability of factory-level soldering.Nano-Grain Technology: The ultra-fine tin powder ensures a consistent, smooth consistency. This allows for effortless “scraping” into stencils, resulting in perfectly uniform BGA balls for high-pin-count ICs.Built-in High-Activity Flux: Formulated with a proprietary flux that initiates cleaning at lower temperatures, ensuring the 200°C reflow results in a bright, mirror-like finish with zero oxidation.Anti-Vibration & Impact Resistant: Once cured, the FS200 creates a rigid, high-density bond that resists the shocks and drops common in mobile device usage.50g Pro-Series Jar: Sealed for freshness, this 50g jar is designed to stay moist and workable for months, making it a cost-effective solution for busy repair centers.Technical Specifications:Brand: 2UULModel: FS200 (Joint X Series)Melting Point: $200°C$Weight: $50\text{g}$Composition: Lead-Free (Sn/Ag/Cu Specialized Blend)Application: CPU Reballing, Power IC Repair, Charging Port Replacement, High-Stress Component Bonding.