Product details
2UUL FS158 JOINT X Solder Paste for Repair 158℃ 50g
The 2UUL FS158 Joint X is a high-performance, medium-temperature solder paste engineered with a precise 158°C melting point. Perfectly balanced between low-melt (138°C) and high-melt (183°C) alloys, it is the ultimate choice for “sandwich” motherboard repairs and middle-frame reballing. With its 50g high-capacity jar, the FS158 ensures strong mechanical bonds and excellent electrical conductivity, allowing technicians to perform complex logic board soldering with reduced heat stress on sensitive
In stock
Delivery: 1-3 Days
Description
The Perfect Thermal Balance for Modern Micro-SolderingIn the era of dual-layer motherboards (iPhone X through iPhone 16 Pro Max), heat management is critical. The 2UUL FS158 Joint X provides a specialized 158°C melting threshold, allowing for easier separation and bonding of board layers without risking the “popcorn effect” on nearby chips or the CPU.Key Features:Optimized 158°C Melting Point: Specially formulated for the “middle layer” of stacked PCBs. It melts lower than standard 183°C paste to protect internal ICs, yet offers significantly higher structural strength than 138°C alloys.Nano-Particle Tin Mud: Features ultra-fine solder particles that ensure smooth, uniform application through high-density stencils. This results in perfectly spherical BGA balls with no bridging.High-Activity Flux Integration: Pre-mixed with a premium high-activity flux that prevents oxidation during the heating process, ensuring “shiny” solder joints with zero cold-soldering defects.Low-Residue “No-Clean” Formula: Leaves behind a minimal, transparent residue that is non-conductive and non-corrosive, maintaining the professional factory look of the device. Exceptional Wetting Properties: The FS158 “Joint X” thrives on difficult-to-bond pads, providing a fast and reliable wetting action that reduces rework time. 50g Professional Bulk Pack: Packaged in a high-quality sealed jar to maintain moisture and prevent the paste from drying out, even in busy, high-volume repair environments.Technical Specifications:Brand: 2UULModel: FS158 (Joint X Series)Alloy Composition: Sn/Bi/Ag (Specialized Medium-Temp Blend)Melting Point: $158°\text{C}$Weight: $50\text{g}$Particle Size: Type 4 / Type 5 (Fine Grade)Application: Middle Layer Reballing, Stacked PCB Repair, iPhone Motherboard Joining, Thermal Sensitive IC Soldering.