2UUL FD15 O BallPoint Golden Soldering Tip

Description

The 2UUL FD15 O BallPoint Golden Soldering Tip is a specialized precision tool that has revolutionized the way technicians handle “Jumper Wire” work and “Pad Rebuilding.” Unlike traditional sharp tips that can easily scratch or pierce delicate motherboard traces, the BallPoint (O-Type) design provides a rounded contact surface that distributes heat evenly, making it the safest choice for micro-soldering on high-density iPhone and Android logic boards.2UUL FD15 O BallPoint Golden Soldering Tip – Precision rounded 0.1mm Micro-Soldering Tip for Jumper Wire & Pad Rebuilding (C210 Series)The 2UUL FD15 O BallPoint is a professional-grade, high-conductivity soldering tip featuring a unique 0.1mm rounded “O-type” head. Engineered for delicate motherboard repair, this golden series tip provides superior heat transfer and a non-piercing contact point, making it ideal for precision jumper wire soldering, pad restoration, and BGA trace work. Compatible with the JBC C210 / T210 handle system, it offers instant thermal recovery and an extended lifespan.The Gold Standard for Delicate Jumper WorkThe 2UUL FD15 Golden Series is designed for the elite technician. By utilizing a high-purity copper core and a specialized “Golden” multi-layer plating, these tips offer faster heat conduction and better oxidation resistance than standard iron tips.Key Features:Unique BallPoint (O-Type) Design: The rounded 0.1mm tip prevents the common “piercing” or “dragging” damage associated with ultra-sharp needles. It allows for a more stable solder bridge when connecting microscopic jumper wires.Instant Thermal Recovery: Features an integrated heating element that allows the tip to reach the target temperature in less than 2 seconds, maintaining a consistent heat flow even on ground-plane-heavy boards.Superior “Golden” Plating: The specialized nano-plating reduces solder “climbing” and oxidation, ensuring that the solder stays exactly at the point of the tip for maximum control.Precision 0.1mm Tip: Despite its rounded nature, the tip remains incredibly fine, allowing it to fit between the tightest components in modern smartphone “sandwich” motherboards.Lead-Free Environmental Compliance: Optimized for modern lead-free solder alloys, providing excellent wetting properties and a smooth, shiny finish on solder joints.Universal C210 Compatibility: Fits all professional handles using the 210 series system, including JBC T210, Sugon T26/T26D, Relife, and 2UUL stations.Technical Specifications:Model: FD15-O (BallPoint)Tip Diameter: 0.1mm (Rounded Head)Series: Golden High-Conductivity SeriesMaterial: Oxygen-Free Copper / Multi-layer Nano-PlatingHandle System: C210 / T210