Product details
2UUL BG02 UNIVERSAL REBALLING STENCIL
The 2UUL BG02 is a premium-grade universal reballing stencil engineered for the high-precision demands of modern GSM repair. Featuring a vast array of high-accuracy square and round holes, it supports a wide spectrum of smartphone ICs, including power management (PMIC), audio codecs, and charging chips. Crafted from high-quality Japanese steel with a specialized 0.12mm thickness, the BG02 ensures perfect solder ball formation while resisting thermal deformation during high-heat BGA rework.
In stock
Delivery: 1-3 Days
Description
Precision Engineering for Flawless BGA RestorationIn the world of micro-soldering, the quality of your stencil determines the success of your reballing. The 2UUL BG02 is designed to eliminate the common frustrations of “bridged” solder balls and warped stencils, providing a reliable foundation for repairing iPhone and Android logic boards.Key Features:Universal Compatibility Matrix: Designed as a “multi-purpose” solution, the BG02 features a comprehensive grid of various hole sizes and pitches. This makes it an essential tool for technicians who work on a diverse range of Android chipsets and legacy iPhone components.Ultra-Precise Square Hole Design: Unlike cheaper round-hole stencils, the BG02 utilizes precision-cut square holes with tapered walls. This facilitates easier solder paste release and ensures that every solder ball is uniform in height and volume.0.12mm Standard Thickness: The stencil is calibrated to a $0.12\text{mm}$ thickness, providing the ideal amount of solder paste for modern high-density PCBs without causing shorts between pads.Superior Heat Resistance: Forged from high-grade stainless steel with anti-drum technology. It maintains its flatness even under the intense heat of professional hot air stations, preventing solder paste from leaking underneath.Laser-Cut Alignment: Every hole is laser-etched for microscopic accuracy. This reduces the time spent on alignment and ensures that the solder balls sit perfectly on the IC pads.Anti-Corrosion Surface: The steel is treated to resist the aggressive chemicals found in high-activity soldering fluxes, ensuring the stencil remains smooth and clean after hundreds of uses.Application Scope:Power ICs (PMIC)Audio Chips & CodecsBaseband & RF TransceiversCharging & USB Control ICsTechnical Specifications:Brand: 2UULModel: BG02 (Universal Series)Material: High-Hardness Japanese SteelThickness: $0.12\text{mm}$Hole Type: Precision Square/Round HybridApplication: Universal BGA Reballing, IC Maintenance, GSM Repair.